The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Feb. 06, 2015
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Yoshimasa Koido, Ibaraki, JP;
Assignee:
JX NIPPON MINING & METALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); B22D 7/00 (2006.01); B22F 3/14 (2006.01); B22F 9/04 (2006.01); B22F 9/22 (2006.01); C22C 1/02 (2006.01); C22C 1/04 (2006.01); C22C 28/00 (2006.01); C23C 14/14 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B22D 7/005 (2013.01); B22F 3/14 (2013.01); B22F 9/04 (2013.01); B22F 9/22 (2013.01); C22C 1/02 (2013.01); C22C 1/04 (2013.01); C22C 28/00 (2013.01); C23C 14/14 (2013.01); H01J 37/3426 (2013.01); B22F 2201/013 (2013.01); B22F 2201/10 (2013.01); B22F 2201/20 (2013.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/205 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01);
Abstract
An Al—Te—Cu—Zr alloy sputtering target, comprising 20 at % to 40 at % of Te, 5 at % to 20 at % of Cu, 5 at % to 15 at % of Zr and the remainder of Al, wherein a Te phase, a Cu phase and a CuTe phase are not present in a structure of the target. An object of the present invention is to provide an Al—Te—Cu—Zr alloy sputtering target capable of effectively reducing particle generation, nodule formation and the like upon sputtering and further capable of reducing oxygen contained in the target.