The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jun. 30, 2016
Applicant:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventor:

Qiaohong Huang, Trabuco Canyon, CA (US);

Assignee:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 4/06 (2006.01); C09J 9/00 (2006.01); C09J 11/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C09J 4/06 (2013.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); H01L 23/295 (2013.01); H01L 23/3142 (2013.01);
Abstract

Provided herein are compositions having a good balance between the curing speed, transparency, tackiness and/or melt viscosity thereof. In one aspect, there are provided compositions containing nano-particulate filler and the use thereof in the preparation of a variety of electronic components, e.g., three-dimensional integrated circuits. In certain aspects, there are provided three-dimensional integrated circuits prepared employing invention compositions (i.e., compositions containing nano-particulate filler), as well as methods for preparing such compositions, and the resulting three-dimensional integrated circuits. In certain aspects, there are also provided methods for improving the curing speed, transparency, tackiness and/or melt viscosity of pre-applied underfill compositions. In certain aspects, there are also provided pre-applied underfill compositions with improved processability.


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