The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Dec. 11, 2015
Applicant:

Solvay Specialty Polymers Usa, Llc, Alpharetta, GA (US);

Inventors:

Mohammad Jamal El-Hibri, Atlanta, GA (US);

Chantal Louis, Alpharetta, GA (US);

Ryan Hammonds, Atlanta, GA (US);

Assignee:

SOLVAY SPECIALTY POLYMERS USA, LLC, Alpharetta, GA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); C08G 65/40 (2006.01); C08J 5/12 (2006.01); H01B 3/30 (2006.01); H01B 3/42 (2006.01); C09D 171/08 (2006.01); C08L 71/08 (2006.01); C08G 75/23 (2006.01); H01B 7/02 (2006.01); H01B 7/18 (2006.01); H01B 13/06 (2006.01);
U.S. Cl.
CPC ...
C08G 65/4012 (2013.01); C08G 65/40 (2013.01); C08G 75/23 (2013.01); C08J 5/124 (2013.01); C08L 71/08 (2013.01); C09D 171/08 (2013.01); H01B 3/301 (2013.01); H01B 3/427 (2013.01); H01B 7/0216 (2013.01); H01B 7/18 (2013.01); H01B 13/06 (2013.01); C08G 2650/40 (2013.01); C08J 2371/00 (2013.01); C08J 2371/10 (2013.01); C08J 2481/06 (2013.01);
Abstract

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.


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