The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Sep. 18, 2015
Applicant:

Tokuyama Corporation, Shunan-shi, Yamaguchi, JP;

Inventors:

Satoko Yoshimura, Shunan, JP;

Takuya Asano, Shunan, JP;

Assignee:

TOKUYAMA CORPORATION, Shunan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 85/30 (2006.01); B65B 29/00 (2006.01); B65D 77/04 (2006.01); B65D 77/08 (2006.01); B65D 77/12 (2006.01);
U.S. Cl.
CPC ...
B65D 85/30 (2013.01); B65B 29/00 (2013.01); B65D 77/04 (2013.01); B65D 77/08 (2013.01); B65D 77/12 (2013.01);
Abstract

A package in which a bag formed from a polyethylene-based resin film having a small thickness, more specifically a thickness of 300 μm or less is filled with crushed polysilicon (Si chunks) and damage to the bag by the Si chunks is effectively prevented. In a polysilicon package in which the bagformed from a polyethylene-based resin having an average thickness of 300 μm or less is filled with the Si chunks, the baghas a heat-sealed bonded partat the bottom and is filled with the Si chunksto ensure that the maximum expansion of the bagbecomes 5% or less when the bagis held in an upright state with the bottom as a ground contact surface.


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