The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Oct. 30, 2015
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Seiji Kobayashi, Tokyo, JP;
Mitsuyoshi Uematsu, Tokyo, JP;
Takahito Shimomukai, Tokyo, JP;
Noriya Hayashi, Tokyo, JP;
Yuji Maruyama, Tokyo, JP;
Hidetaka Hattori, Tokyo, JP;
Junko Watanabe, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
In an artificial defect materialof an FRP structure, a heat-resistant high-linear-expansion materialarranged between the layers thermally expands in case of high-temperature shaping of the FRP structure, so that a predetermined shape is shaped between a plurality of layers of the fiber reinforcing base materialand the materialthermally shrinks at the room temperature after the shaping, so that a space is formed due to the shrinkage difference from the fiber reinforcing base materials. The materialhas a linear expansion coefficient larger than that of the FRP structure by a predetermined value or more, and has the shape keeping property and the heat resistance to endure the shaping temperature.