The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jan. 05, 2018
Applicant:

Dengensha Toa Co., Ltd., Kanagawa, JP;

Inventors:

Yoshiaki Iwamoto, Kanagawa, JP;

Shuhei Saeki, Kanagawa, JP;

Assignee:

Dengensha Toa Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/44 (2006.01); B29C 65/00 (2006.01); B29C 65/30 (2006.01);
U.S. Cl.
CPC ...
B29C 65/44 (2013.01); B29C 65/30 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/3472 (2013.01); B29C 66/3494 (2013.01); B29C 66/71 (2013.01); B29C 66/7392 (2013.01); B29C 66/73116 (2013.01); B29C 66/7422 (2013.01); B29C 66/8122 (2013.01); B29C 66/81261 (2013.01); B29C 66/81262 (2013.01); B29C 66/845 (2013.01);
Abstract

A metal-resin joining device joins a thermoplastic resin plate () to a metal plate () by melting the resin plate () in contact with the metal plate () through heating an exposed face of the metal plate () by one-sided resistive heating. The metal-resin joining device has a center electrode () that is brought in contact with the metal plate () and a peripheral electrode () that is brought in contact with the metal plate () to annularly surround the center electrode () and to which a current flows from the center electrode () via the metal plate (), wherein the peripheral electrode () is made of a metal material having a higher electrical resistance than the center electrode ().


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