The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Feb. 05, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Michael Evans Graham, Slingerlands, NY (US);

Lang Yuan, Niskayuna, NY (US);

Thomas Adcock, Niskayuna, NY (US);

Justin Gambone, Jr., Niskayuna, NY (US);

James Sears, Reading, PA (US);

John Madelone, South Glens Falls, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 50/02 (2015.01); G05B 19/4099 (2006.01); B23K 26/08 (2014.01); B23K 26/354 (2014.01); B23K 26/082 (2014.01); B23K 26/34 (2014.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0876 (2013.01); B23K 26/082 (2015.10); B23K 26/34 (2013.01); B23K 26/354 (2015.10); B33Y 50/02 (2014.12); G05B 19/4099 (2013.01); G05B 2219/35134 (2013.01); G05B 2219/49007 (2013.01); G06F 17/50 (2013.01); G06F 2217/12 (2013.01);
Abstract

A method includes applying thermal and/or strain modeling to the CAD representation of an object. In addition, scan path data is generated based at least in part on a result of the thermal and/or strain modeling. A build file comprising the scan path data is generated. The build file comprises instructions that configure an additive manufacturing tool to generate the object according to the scan path data.


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