The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10518353 B1

Date of Patent:

Dec. 31, 2019

Filed:

Oct. 17, 2018

Bonded functionally graded material structure for heat transfer and cte matching and method of making same

Applicant:

Cooler Master Co., Ltd., New Taipei, TW;

Inventor:

Ralph Remsburg, Midland, TX (US);

Assignee:

Other;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Stephanie P Duclair

Int. Cl.

CPC ...

H01L 21/02 (2006.01); H01L 23/373 (2006.01); H01L 21/311 (2006.01); H01L 21/3065 (2006.01); C22C 9/00 (2006.01); B32B 3/26 (2006.01); B32B 15/01 (2006.01); B23K 35/30 (2006.01); B23K 35/28 (2006.01); B23K 35/02 (2006.01); B23K 26/382 (2014.01); B23K 26/361 (2014.01); B23K 26/352 (2014.01); B23K 20/24 (2006.01); B23K 20/233 (2006.01); B23K 20/02 (2006.01); B23K 20/00 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01);

U.S. Cl.

CPC ...

B23K 20/2333 (2013.01); B23K 20/002 (2013.01); B23K 20/021 (2013.01); B23K 20/023 (2013.01); B23K 20/24 (2013.01); B23K 26/355 (2018.08); B23K 35/0255 (2013.01); B23K 35/286 (2013.01); B23K 35/302 (2013.01); B32B 3/266 (2013.01); B32B 15/01 (2013.01); B32B 15/017 (2013.01); C22C 9/00 (2013.01); H01L 21/022 (2013.01); H01L 21/30655 (2013.01); H01L 21/31111 (2013.01); H01L 21/31133 (2013.01); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); H01L 21/02658 (2013.01); H01L 23/3735 (2013.01);

Abstract

A method for producing a bonded functionally graded Material (FGM) structure, includes the steps of providing a plurality of dissimilar material layers; forming a first group and a second group of through holes alternately on a plurality of intermediate dissimilar material layers and on a bottom dissimilar material layer, wherein the first group of through holes has a diameter larger than a diameter of the second group of through holes; stacking the plurality of dissimilar material layers on top of one another. A first group of through holes on any dissimilar material layer is arranged corresponding to a second group of through holes on a dissimilar material layer stacked above, and a second group of through holes on any dissimilar material layer is arranged corresponding to a first group of through holes on a dissimilar material stacked right below; and bonding the plurality of dissimilar material layers.

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