The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Dec. 13, 2018
Applicant:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

Inventors:

Dale L. Huber, Albuquerque, NM (US);

John Daniel Watt, Albuquerque, NM (US);

Jonathan Chavez, Grovetown, GA (US);

Lauren Marie Ammerman, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 9/04 (2006.01); B22F 9/16 (2006.01); B22F 1/00 (2006.01); B22F 9/20 (2006.01); B82Y 40/00 (2011.01); B22F 9/00 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B22F 9/04 (2013.01); B22F 1/0018 (2013.01); B22F 1/0044 (2013.01); B22F 9/16 (2013.01); B22F 9/20 (2013.01); B22F 2009/001 (2013.01); B22F 2301/255 (2013.01); B22F 2304/054 (2013.01); B22F 2999/00 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

A method for creating nanoparticles directly from bulk metal by applying ultrasound to the surface in the presence of a two-part surfactant system. Implosive collapse of cavitation bubbles near the bulk metal surface generates powerful microjets, leading to material ejection. This liberated material is captured and stabilized by a surfactant bilayer in the form of nanoparticles. Nanoparticles can be produced regardless of the bulk metal form factor. The method is generally applicable of metals and alloys. The method can be applied to an environmentally important problem, the reclamation of gold from an electronic waste stream.


Find Patent Forward Citations

Loading…