The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jun. 20, 2013
Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Yoichi Kamikoriyama, Saitama, JP;

Shigeki Nakayama, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); C22C 9/00 (2006.01); B22F 9/24 (2006.01); H01B 1/02 (2006.01); H05K 1/09 (2006.01); B22F 3/10 (2006.01); B22F 9/20 (2006.01); C22B 15/00 (2006.01); H01B 1/22 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/00 (2013.01); B22F 3/10 (2013.01); B22F 9/20 (2013.01); B22F 9/24 (2013.01); C22B 15/0063 (2013.01); C22C 9/00 (2013.01); H01B 1/026 (2013.01); H01B 1/22 (2013.01); H01B 13/00 (2013.01); H05K 1/097 (2013.01); B22F 1/0018 (2013.01); H05K 2203/1157 (2013.01); Y10T 428/12014 (2015.01);
Abstract

Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 μm, having a ratio of D to D, D/D, of 0.8 to 4.0 wherein Dis a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mixing (1) hydrazine and (2) a reactant mixture including a monovalent or divalent copper source and a liquid medium which includes water and an organic solvent having water miscibility and capable of reducing the surface tension of water, to reduce the copper source to form copper particles.


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