The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2019
Filed:
Dec. 02, 2015
Applicant:
Massachusetts Institute of Technology, Cambridge, MA (US);
Inventors:
Bradley D. Olsen, Arlington, MA (US);
Matthew J. Glassman, Yorba Linda, CA (US);
Reginald K. Avery, Bel Air, MD (US);
Assignee:
Massachusetts Institute of Technology, Cambridge, MA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61L 26/00 (2006.01); A61K 8/64 (2006.01); A61Q 19/08 (2006.01);
U.S. Cl.
CPC ...
A61L 26/008 (2013.01); A61K 8/64 (2013.01); A61L 26/0047 (2013.01); A61Q 19/08 (2013.01); A61K 2800/91 (2013.01); A61L 2300/252 (2013.01); A61L 2430/02 (2013.01); A61L 2430/06 (2013.01); A61L 2430/34 (2013.01);
Abstract
Elastin-like polypeptides (ELPs) form hydrogels upon heating. The polypeptides can comprise the generic sequence (XPAVG)(SEQ ID NO: 4), wherein independently for each occurrence X can be any one of a number of different natural or unnatural amino acids, and n is chosen to determine the size of the protein. Hydrogels comprising the polypeptides have mechanical properties, including elastic modulus and fracture toughness, required for load-bearing applications.