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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10517171 B1

PDFFull Text
Date of Patent:
Dec. 24, 2019

Filed:

Jul. 25, 2016

Method for fabricating flexible substrate

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hye Won Jeong, Daejeon, KR;

Yong Goo Son, Daejeon, KR;

Kyungjun Kim, Daejeon, KR;

Bo Ra Shin, Daejeon, KR;

Chang Yoon Lim, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Austin Murata

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/08 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01); F21K 99/00 (2016.01); H01B 3/30 (2006.01); H01B 5/14 (2006.01); H01B 7/04 (2006.01); H01B 13/00 (2006.01); H01L 31/0236 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); B32B 15/08 (2013.01); F21K 99/00 (2013.01); H01B 3/30 (2013.01); H01B 5/14 (2013.01); H01B 7/04 (2013.01); H01B 13/00 (2013.01); H01L 31/0236 (2013.01); H01L 51/0023 (2013.01); H01L 51/0097 (2013.01); H05K 1/0283 (2013.01); H05K 1/0313 (2013.01); H05K 1/0346 (2013.01); H05K 3/0041 (2013.01); H05K 3/20 (2013.01); H05K 3/207 (2013.01); H01L 51/445 (2013.01); H01L 51/5212 (2013.01); H01L 51/5228 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0317 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/1545 (2013.01); Y02E 10/549 (2013.01); Y02P 20/582 (2015.11);
Abstract

The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.

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Jeong, Hye. (2019). Method for fabricating flexible substrate (U.S. Patent No. 10517171). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10517171

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