The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

May. 21, 2018
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Scott Roger Westerfield, Everett, WA (US);

Robert Arthur Nye, Lynnwood, WA (US);

Robert Thomas Johnson, Everett, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/533 (2006.01); H01R 13/52 (2006.01); H01R 13/42 (2006.01); H01R 13/74 (2006.01);
U.S. Cl.
CPC ...
H01R 13/533 (2013.01); H01R 13/42 (2013.01); H01R 13/521 (2013.01); H01R 13/74 (2013.01); H01R 13/5202 (2013.01);
Abstract

An electrical multi-connector feedthrough panel for sealing a penetration in a structure across a pressure differential, the panel including a frame having a first environmental interface surface and a second environmental interface surface configured to couple with the structure so that the first environmental interface surface and the second environmental interface surface span the penetration so as to at least in part seal the penetration, and a plurality of electrical connector insert shells monolithically formed with the frame, each of the plurality of electrical connector insert shells being configured to sealingly couple with at least one electrical connector, where the first environmental interface surface is disposed between the plurality of connector shells so as to be in fluid communication with a first pressurized environment, and the second environmental interface surface is disposed between the plurality of connector shells so as to be in fluid communication with a second pressurized environment.


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