The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
May. 30, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Manfred Schindler, Regensburg, DE;
Klaus Elian, Alteglofsheim, DE;
Volker Strutz, Tegernheim, DE;
Horst Theuss, Wenzenbach, DE;
Michael Weber, Mainburg, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/4952 (2013.01); H01L 23/49562 (2013.01); H01L 23/49589 (2013.01); H01L 23/3107 (2013.01); H01L 23/49558 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.