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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10515872 B1

PDFFull Text
Date of Patent:
Dec. 24, 2019

Filed:

Oct. 20, 2016

Metallic sub-collector for hbt and bjt transistors

Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

James Chingwei Li, Simi Valley, CA (US);

Yakov Royter, Santa Monica, CA (US);

Pamela R. Patterson, Los Angeles, CA (US);

Donald A. Hitko, Olney, MD (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:

Ladas & Parry

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/48 (2006.01); H01L 29/66 (2006.01); H01L 23/373 (2006.01); H01L 21/683 (2006.01); H01L 29/49 (2006.01); H01L 23/535 (2006.01); H01L 21/74 (2006.01); H01L 21/304 (2006.01); H01L 21/20 (2006.01); H01L 29/737 (2006.01); H01L 33/64 (2010.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/2007 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); H01L 21/74 (2013.01); H01L 21/743 (2013.01); H01L 23/3732 (2013.01); H01L 23/3738 (2013.01); H01L 23/535 (2013.01); H01L 29/401 (2013.01); H01L 29/495 (2013.01); H01L 29/66242 (2013.01); H01L 29/66265 (2013.01); H01L 29/66318 (2013.01); H01L 29/7371 (2013.01); H01L 33/64 (2013.01); H01L 29/41708 (2013.01); H01L 29/452 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68368 (2013.01);
Abstract

A transistor having an emitter, a base, and a collector, the transistor includes a substrate, a collector contact, a metallic sub-collector coupled to the collector contact, and the metallic sub-collector electrically and thermally coupled to the collector, and an adhesive layer between the substrate and the metallic sub-collector, the adhesive layer bonded to the substrate and in direct contact with the substrate and bonded to the metallic sub-collector and in direct contact with the metallic sub-collector, wherein the adhesive layer comprises an electrically conductive material.

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