The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Oct. 24, 2017
Applicant:
Murata Machinery, Ltd., Kyoto-shi, Kyoto, JP;
Inventors:
Gerhard Dovids, Grabs, CH;
Yves Fenner, Berg, CH;
John Fiddes, Kreuzlingen, CH;
Christian Wohanka, Tägerwilen, CH;
Bernd Rahrbach, Constance, DE;
Assignee:
MURATA MACHINERY, LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/673 (2006.01); B25J 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67769 (2013.01); B25J 11/0095 (2013.01); H01L 21/67346 (2013.01); H01L 21/67383 (2013.01); H01L 21/67389 (2013.01); H01L 21/67742 (2013.01); H01L 21/67778 (2013.01);
Abstract
The invention disclosed relates generally to handling substrates and wafers. In an example embodiment, to an improved wafer and substrate carrier or carrier system, method or apparatus. More specifically, to a carrier with improved abilities which may provide high density carriers, improved efficiency and other abilities such as increased cleanliness and reduced contamination to wafers during handling, storage or processing as well as higher density storage and better stocking, storage and handling abilities.