The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Apr. 14, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Kang Wook Bong, Suwon-si, KR;
Boum Seock Kim, Suwon-si, KR;
Jae Hun Kim, Suwon-si, KR;
Jong Sik Yoon, Suwon-si, KR;
Byeong Cheol Moon, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 27/255 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 27/327 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 41/127 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01);
Abstract
A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.