The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Nov. 07, 2016
Applicant:

Sumitomo Wiring Systems, Ltd., Mie, JP;

Inventors:

Osamu Satou, Mie, JP;

Masamichi Yamagiwa, Mie, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 5/02 (2006.01); H01B 5/12 (2006.01); H01B 7/04 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01); H01B 5/08 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01B 5/02 (2013.01); C22F 1/08 (2013.01); H01B 1/026 (2013.01); H01B 5/08 (2013.01); H01B 5/12 (2013.01); H01B 7/04 (2013.01); H01B 13/0013 (2013.01);
Abstract

Sufficient welding of multiple metal wires in at least a portion of a conductive member that is constituted by multiple metal wires is enabled. The conductive member includes multiple metal wires each including a metal strand and a metal covering layer formed around the metal strand, and a joined portion in which the metal wires are joined by melting of alloy portions of the metal covering layers, the alloy portions including the metal that forms the metal strands. The joined portion can be formed by joining the metal wires to each other by performing heating at a temperature higher than the melting point of the alloy portions of the metal covering layers, the alloy portions including the metal that forms the metal strands.


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