The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Oct. 21, 2016
Applicants:

Joyce Kai See Poon, Toronto, CA;

Zheng Yong, Toronto, CA;

Wesley David Sacher, Mississauga, CA;

Inventors:

Joyce Kai See Poon, Toronto, CA;

Zheng Yong, Toronto, CA;

Wesley David Sacher, Mississauga, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/134 (2006.01); G02F 1/025 (2006.01); G02F 1/225 (2006.01); G02F 1/21 (2006.01);
U.S. Cl.
CPC ...
G02B 6/1347 (2013.01); G02F 1/025 (2013.01); G02F 1/2257 (2013.01); G02F 2001/212 (2013.01);
Abstract

A method of fabricating a P-N junction in a semiconductor structure, e.g. silicon (Si) structure, is presented. The method may include several implantation steps performed at a single implantation angle with respect to the Si structure. In a first implantation step, a first dopant species is implanted over a first portion of the Si structure including a first edge of the Si structure. In a second implantation step, a second dopant species is implanted over a second portion of the Si structure including a second edge of the Si structure opposed to the first edge but excluding the first edge. The first portion and the second portion may overlap in a central portion of the Si structure between the first edge and the second edge, such that the second dopant species may be implanted below the first dopant species. In a third implantation step, the second dopant species is implanted over the second portion of the Si structure including the second edge of the Si structure opposed to the first edge but excluding the first edge, such that the second dopant species is implanted above the first dopant species.


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