The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Jun. 01, 2015
Applicant:
Saginomiya Seisakusho, Inc., Tokyo, JP;
Inventors:
Assignee:
SAGINOMIYA SEISAKUSHO, INC., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L 19/06 (2006.01); G01L 19/14 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
G01L 19/069 (2013.01); G01L 19/0046 (2013.01); G01L 19/0645 (2013.01); G01L 19/14 (2013.01); G01L 19/147 (2013.01);
Abstract
In a sensor unit, a lower end surface of a terminal block () is attached to an upper end surface (ES) of a housing () by using a silicone-based adhesive in such a way as to cover an upper end surface (ES) of a hermetic glass (). A covering layer (A) made of a silicone-based adhesive is formed in a given thickness on the entire upper end surface (ES) of the hermetic glass (), from which a group of input-output terminals () protrude.
Takimoto, Kazuya. (2019). Sensor unit having a sensor chip and pressure detection device containing same (U.S. Patent No. 10514314). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10514314
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile