The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Aug. 16, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Hironobu Shibata, Tokushima, JP;

Soichiro Miura, Tokushima, JP;

Takashi Namie, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/64 (2016.01); F21V 7/22 (2018.01); F21V 19/00 (2006.01); F21V 7/04 (2006.01); F21V 13/08 (2006.01); F21Y 115/30 (2016.01); F21V 9/00 (2018.01);
U.S. Cl.
CPC ...
F21K 9/64 (2016.08); F21V 7/041 (2013.01); F21V 7/22 (2013.01); F21V 13/08 (2013.01); F21V 19/0025 (2013.01); F21V 9/00 (2013.01); F21Y 2115/30 (2016.08);
Abstract

A light emitting device includes a semiconductor laser element configured to emit a first light, a wavelength converting member configured to emit a second light upon being irradiated by the first light, and a support member defining a through-hole allowing an optical path of the first light to pass through. The through-hole is defined by, in order from a light incident side to a light emitting side with respect to the first light, a lower portion with opening width decreasing from the light incident side to the light emitting side, and an upper portion where the wavelength converting member is fixed. The semiconductor laser element is disposed at a location allowing the first light to enter the lower portion of the through-hole while also allowing a part of the first light to be reflected at a wall defining the lower portion of the through-hole.


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