The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Nov. 10, 2015
Applicants:

Dow Global Technologies Llc, Midland, MI (US);

Rohm and Haas Company, Philadelphia, PA (US);

Inventors:

Joseph J. Zupancic, Glen Ellyn, IL (US);

Amira A. Marine, Missouri City, TX (US);

David E. Vietti, Cary, IL (US);

Daniele Vinci, Lucerne, CH;

Assignees:

Dow Global Technologies LLC, Midland, MI (US);

Rohm and Haas Company, Collegeville, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 167/00 (2006.01); C09D 167/00 (2006.01); C08L 67/00 (2006.01); C08K 5/52 (2006.01); C08L 63/00 (2006.01); C08K 5/29 (2006.01); C08L 67/02 (2006.01); C08L 75/06 (2006.01);
U.S. Cl.
CPC ...
C09J 167/00 (2013.01); C08K 5/29 (2013.01); C08K 5/52 (2013.01); C08L 63/00 (2013.01); C08L 67/00 (2013.01); C08L 67/025 (2013.01); C08L 75/06 (2013.01); C09D 167/00 (2013.01);
Abstract

The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.


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