The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Dec. 20, 2016
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventor:
Ai Takamori, Osaka, JP;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 129/14 (2006.01); B31F 1/28 (2006.01); B31F 1/22 (2006.01); C09J 123/08 (2006.01); C08L 23/08 (2006.01); C08L 91/06 (2006.01);
U.S. Cl.
CPC ...
C09J 129/14 (2013.01); B31F 1/225 (2013.01); B31F 1/2818 (2013.01); C08L 23/0815 (2013.01); C08L 23/0869 (2013.01); C08L 91/06 (2013.01); C09J 123/08 (2013.01);
Abstract
The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing, and has excellent thermal stability and adhesion, in particular adhesion to a paper material. The present invention relates to a hot melt adhesive comprising: (A) an olefin-based polymer, (B) a butyral resin, (C) at least one selected from the group consisting of a fatty acid and a derivative thereof, and (D) a tackifier resin.
Takamori, Ai. (2019). Hot melt adhesive (U.S. Patent No. 10513639). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10513639
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile