The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Jun. 09, 2016
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Hisaya Ushiyama, Tokyo, JP;
Kenichi Watanabe, Tokyo, JP;
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Abstract
An epoxy resin composition includes an organic phosphinic acid metal salt; an epoxy resin; dicyandiamide or a derivative thereof; a curing accelerator having a dimethylureido group; and an imidazole-based curing accelerator having a curing initiation temperature of 100° C. or higher. The curing initiation temperature is measured by a method includes preparing a sample resin composition by adding 10 parts by mass of an imidazole-based curing accelerator to 100 parts by mass of a bisphenol A type epoxy resin having an epoxy equivalent of 180 to 220, and mixing the components; measuring a calorific value of the sample resin composition using a differential scanning calorimeter at a rate of temperature increase of 10° C./min, and designating a temperature at the intersection point of the tangent line at the inflection point of the DSC curve thus obtained and the baseline as the curing initiation temperature.