The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Mar. 19, 2018
Applicant:

Sii Printek Inc., Chiba-shi, Chiba, JP;

Inventors:

Hitoshi Nakayama, Chiba, JP;

Takeshi Sugiyama, Chiba, JP;

Daichi Nishikawa, Chiba, JP;

Eriko Maeda, Chiba, JP;

Assignee:

SII PRINTEK INC., Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14209 (2013.01); B41J 2/1607 (2013.01); B41J 2/1609 (2013.01); B41J 2/1632 (2013.01); B41J 2/1634 (2013.01); B41J 2/1643 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/18 (2013.01);
Abstract

According to an embodiment, an ink jet head (liquid ejecting head) includes an actuator plate and a cover plate (see FIG.). As illustrated in FIG., channel grooves for a discharge channel (ejection channel) and a non-discharge channel (non-ejection channel) in a Z-direction are formed on a front surface of the actuator plate, so as to be alternately arranged in an X-direction, by cutting with a dicing blade or the like. The discharge channel and the non-discharge channel are formed to have a groove width W of smaller than 70 μm, in order to correspond to high density of nozzles. In the embodiment, the discharge channel and the non-discharge channel are formed to have a groove width of 55 μm, 50 μm, or 40 μm, for example.


Find Patent Forward Citations

Nakayama, Hitoshi. (2019). Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chip (U.S. Patent No. 10513117). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10513117

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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