The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Mar. 13, 2015
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Robert Arthur Kisch, Auburn, WA (US);

Peter D. McCowin, Enumclaw, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/14 (2006.01); B29C 70/54 (2006.01); B29D 99/00 (2010.01); B32B 3/04 (2006.01); B32B 5/00 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 5/26 (2006.01); B32B 7/02 (2019.01); B64C 1/06 (2006.01); B29C 70/38 (2006.01); B64C 3/18 (2006.01); B64C 3/20 (2006.01);
U.S. Cl.
CPC ...
B32B 37/14 (2013.01); B29C 70/38 (2013.01); B29C 70/54 (2013.01); B29D 99/0003 (2013.01); B32B 3/04 (2013.01); B32B 5/00 (2013.01); B32B 5/02 (2013.01); B32B 5/024 (2013.01); B32B 5/12 (2013.01); B32B 5/26 (2013.01); B32B 7/02 (2013.01); B64C 1/064 (2013.01); B64C 1/065 (2013.01); B32B 2250/05 (2013.01); B32B 2250/44 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2307/732 (2013.01); B32B 2309/105 (2013.01); B32B 2605/18 (2013.01); B64C 3/182 (2013.01); B64C 3/185 (2013.01); B64C 3/20 (2013.01); Y02T 50/43 (2013.01);
Abstract

Apparatuses for creating layered tape composite structures include a frame, a source of first tape, and a first tape placement module configured to receive first tape and place the first tape on a layup surface as the frame translates along the layup surface. Some apparatuses further include a source of second tape, and a second tape placement module configured to receive second tape and place the second tape on the first tape as the frame moves along the layup surface. Methods for creating layered tape composite structures include supplying a first tape, and placing the first tape on a layup surface. Some methods further include supplying a second tape, and placing the second tape on the first tape on the layup surface.


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