The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2019

Filed:

Jun. 10, 2016
Applicant:

Nok Corporation, Tokyo, JP;

Inventor:

Takeshi Masaka, Kikugawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); F16J 15/10 (2006.01); B29C 45/00 (2006.01); H01M 8/0276 (2016.01); H01M 8/0286 (2016.01); B29K 21/00 (2006.01); B29L 31/26 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B29C 45/0025 (2013.01); B29C 45/14 (2013.01); B29C 45/14336 (2013.01); F16J 15/10 (2013.01); H01M 8/0276 (2013.01); H01M 8/0286 (2013.01); B29C 2045/14459 (2013.01); B29C 2045/14868 (2013.01); B29C 2045/14959 (2013.01); B29K 2021/00 (2013.01); B29K 2905/00 (2013.01); B29L 2031/26 (2013.01); B29L 2031/265 (2013.01); B29L 2031/3468 (2013.01); B32B 2581/00 (2013.01); Y02P 70/56 (2015.11); Y10T 428/215 (2015.01);
Abstract

A method of manufacturing a substrate integrated gasket that includes applying an adhesive agent onto a surface of the substrate in a pattern that corresponds to a configuration of the substrate integrated gasket, wherein the pattern of the adhesive agent includes a first section having dimensions that correspond to a length and width of substrate integrated gasket, a plurality of second sections that extend away from the first section, and third sections that do not include the adhesive agent. The third sections that do not include the adhesive agent define a passageway between a mold cavity to an exterior of the mold that is configured to expel a gas from the mold cavity during injection of a molding material into the mold cavity.


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