The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
May. 25, 2018
Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
Skc Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jaein Ahn, Seongnam-si, KR;
Jang Won Seo, Busan, KR;
Sunghoon Yun, Seongnam-si, KR;
Su Young Moon, Anyang-si, KR;
Myung-Ok Kyun, Suwon-si, KR;
SKC CO., LTD., Suwon-si, KR;
Abstract
The embodiments relate to a porous polyurethane polishing pad and a process for preparing a semiconductor device by using the same. The porous polyurethane polishing pad comprises a urethane-based prepolymer and a curing agent, and has a thickness of 1.5 to 2.5 mm, a number of pores whose average diameter is 10 to 60 μm, a specific gravity of 0.7 to 0.9 g/cm, a surface hardness at 25° C. of 45 to 65 Shore D, a tensile strength of 15 to 25 N/mm, an elongation of 80 to 250%, an AFM (atomic force microscope) elastic modulus of 30 to 100 MPa measured from a polishing surface in direct contact with an object to be polished to a predetermined depth wherein the predetermined depth is 1 to 10 μm.