The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Aug. 26, 2014
Applicant:
Jiangsu University, Jiangsu, CN;
Inventors:
Assignee:
Jiangsu University, Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/352 (2014.01); C21D 1/09 (2006.01); B23K 26/146 (2014.01); B23K 26/356 (2014.01); B23K 26/073 (2006.01); B23K 26/18 (2006.01); C21D 10/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/3576 (2018.08); B23K 26/0732 (2013.01); B23K 26/146 (2015.10); B23K 26/18 (2013.01); B23K 26/356 (2015.10); C21D 1/09 (2013.01); C21D 10/005 (2013.01);
Abstract
Provided is a laser shock peening method for obtaining a large-area uniform surface morphology. Using the relationship between the thickness of an absorption layer and a plastic deformation due to the laser shock peening and using a grid-shaped absorption layer () having a staggered distribution in thickness in cooperation with a two-layer interlaced laser shock processing method significantly reduce the height difference between micro-protrusions () and micro-pits () produced by an impact of a square light spot, and effectively reduce the roughness of the workpiece surface such that a large-area uniform surface morphology is formed on the workpiece surface.