The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2019
Filed:
Sep. 07, 2017
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Anthony T Chobot, Goleta, CA (US);
Raymond M. Karam, Santa Barbara, CA (US);
Georges Roussos, San Jose, CA (US);
Assignee:
CORNING INCORPORATED, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B01L 3/00 (2006.01); C23F 1/00 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); B32B 27/40 (2006.01); B32B 3/04 (2006.01); B32B 7/06 (2019.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B32B 3/04 (2013.01); B32B 3/263 (2013.01); B32B 3/266 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 9/045 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/304 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); C23F 1/00 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0887 (2013.01); B01L 2400/0415 (2013.01); B32B 2255/00 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2307/412 (2013.01); B32B 2307/546 (2013.01); B32B 2307/58 (2013.01); B32B 2307/748 (2013.01);
Abstract
A flow cell incorporates a first substrate with a metal layer on one surface. A tape layer having flow channels is adhered to the first substrate. A second substrate having a second metal layer on one surface is adhered to the tape layer opposite the first substrate. At least one of the first and second metal layers includes mating cutouts to at least partially expose the flow channels.