The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Sep. 05, 2017
Denso Corporation, Kariya, Aichi-pref., JP;
Tokin Corporation, Sendai, Miyagi, JP;
Naoki Hirasawa, Nihio, JP;
Ryota Tanabe, Kariya, JP;
Takashi Kawashima, Kariya, JP;
Takashi Yanbe, Sendai, JP;
Masahiro Kondou, Sendai, JP;
DENSO CORPORATION, Kariya, JP;
TOKIN CORPORATION, Sendai, JP;
Abstract
A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.