The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Aug. 13, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Satoshi Ishibashi, Tokyo, JP;

Yuji Kuramoto, Tokyo, JP;

Toshio Watanabe, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02K 5/20 (2006.01); H05K 5/06 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2089 (2013.01); H02K 5/20 (2013.01); H05K 5/06 (2013.01); H05K 7/20263 (2013.01); H01L 23/473 (2013.01);
Abstract

A power converting device includes a heat sink including a heat sink base portion on an upper face side of which a depressed portion forming a refrigerant channel is provided and a heat sink upper plate covering the depressed portion of the heat sink base portion, wherein the refrigerant channel is sealed using a channel seal provided in an outer peripheral portion of the heat sink upper plate, an upper case caused to cover an upper face side of the heat sink, a lower case caused to cover a lower face side of the heat sink, and a terminal block forming a waterproofing wall that encloses a power module projecting from an upper face of the heat sink upper plate between the power module on the heat sink upper plate and the channel seal in the upper case.


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