The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jun. 25, 2018
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Inventors:

Tokihito Suwa, Hitachinaka, JP;

Yujiro Kaneko, Hitachinaka, JP;

Yusuke Takagi, Hitachinaka, JP;

Shinichi Fujino, Mito, JP;

Takahiro Shimura, Mito, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H02M 7/537 (2006.01); H05K 7/14 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0247 (2013.01); H01L 23/473 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/34 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H02M 7/537 (2013.01); H05K 7/1432 (2013.01); H05K 7/2089 (2013.01); H05K 7/20845 (2013.01); H05K 7/20927 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/48 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/207 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/351 (2013.01);
Abstract

A power semiconductor device includes a first power semiconductor element, a second power semiconductor element, a first conductor plate, a second conductor plate, a third conductor plate, and a fourth conductor plate. The power semiconductor device also includes a DC positive terminal, a DC negative terminal, an AC terminal, and a sealing member that integrally seals the first conductor plate, the second conductor plate, the third conductor plate, and the fourth conductor plate. Each of the DC positive terminal, the DC negative terminal, and the AC terminal has a cut section formed by cutting a tie bar that integrally couples the DC positive terminal, the DC negative terminal, and the AC terminal.


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