The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Oct. 27, 2016
Applicants:

Tyco Electronics (Dongguan) Co., Ltd., Dongguan, CN;

Tyco Electronics (Shanghai) Co., Ltd, Shanghai, CN;

Shenzhen Ami Technology Co. Ltd, Shenzhen, CN;

Te Connectivity Germany Gmbh, Bensheim, DE;

Inventors:

Hongzhou Shen, Shanghai, CN;

Dandan Zhang, Shanghai, CN;

Qinglong Zeng, Shanghai, CN;

Roberto Francisco-Yi Lu, Berwyn, PA (US);

George Dubniczki, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 3/40 (2006.01); H05K 3/40 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 3/08 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/403 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 3/08 (2013.01); H05K 1/117 (2013.01); H05K 3/101 (2013.01); H05K 3/3405 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/0165 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/16 (2013.01);
Abstract

A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.


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