The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Dec. 08, 2016
Applicant:

Saint-gobain Glass France, Courbevoie, FR;

Inventors:

Katja Werner, Simmerath, DE;

Bernhard Reul, Herzogenrath, DE;

Klaus Schmalbuch, Aachen, DE;

Camille Dassonville, Compiegne, FR;

Clément Briquet, Elincourt Sainte Marguerite, FR;

Juliette Jamart, Compiegne, FR;

Assignee:

SAINT-GOBAIN GLASS FRANCE, Courbevoie, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); C03C 17/06 (2006.01); C03C 17/36 (2006.01); B23K 35/26 (2006.01); C03C 17/04 (2006.01); C03C 17/10 (2006.01); C22C 13/00 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/26 (2006.01); B23K 13/01 (2006.01); B60R 16/02 (2006.01); H01Q 1/32 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3457 (2013.01); B23K 13/01 (2013.01); B23K 35/262 (2013.01); C03C 17/04 (2013.01); C03C 17/06 (2013.01); C03C 17/10 (2013.01); C03C 17/36 (2013.01); C22C 13/00 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/26 (2013.01); B23K 2101/38 (2018.08); B60R 16/02 (2013.01); C03C 2217/256 (2013.01); C03C 2217/42 (2013.01); C03C 2217/425 (2013.01); H01Q 1/32 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A glazing includes at least one substrate, one portion of which includes an electrically conductive element, the conductive element including a connector made of chromium-containing steel, which connector is soldered with a solder based on tin, silver and copper to an electrically conductive track, wherein the electrically conductive track, which is formed by fritting a silver paste including a mixture of silver powder and glass frit, has a resistivity measured at 25° C. lower than or equal to 3.5 μΩ·cm and a porosity level lower than 20%, the porosity level being measured by scanning electron microscopy from a cross section through the portion of the substrate including the electrically conductive track and having been polished beforehand by ion milling.


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