The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Sep. 19, 2018
Applicant:

Schlage Lock Company Llc, Carmel, IN (US);

Inventor:

Russell L. Steiner, St. Helen, MI (US);

Assignee:

Schlage Lock Company LLC, Carmel, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); H05K 1/0201 (2013.01); H05K 3/303 (2013.01); H05K 3/3442 (2013.01); H05K 3/3452 (2013.01); H05K 1/0206 (2013.01); H05K 2201/10727 (2013.01); H05K 2201/10969 (2013.01); H05K 2203/1178 (2013.01);
Abstract

A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mounted to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.


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