The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Apr. 27, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Hidenori Ishibashi, Tokyo, JP;
Kiyoshi Ishida, Tokyo, JP;
Eigo Kuwata, Tokyo, JP;
Yukinobu Tarui, Tokyo, JP;
Hideharu Yoshioka, Tokyo, JP;
Hiroyuki Aoyama, Tokyo, JP;
Masaomi Tsuru, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/66 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/021 (2013.01); H01L 23/66 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 2201/10121 (2013.01);
Abstract
A printed wiring board includes conductor layers, a core layer having an opening, and a build-up layer. A high frequency device placed within the opening is installed such that a mirror surface is thermally connected to a conductor layer for heat dissipation facing the opening from a lower surface side of the core layer, and terminals on the terminal surface are electrically connected to conductor layers formed on an upper surface side of the core layer.