The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Apr. 12, 2018
Applicant:

Conary Enterprise Co., Ltd., Taipei, TW;

Inventor:

Hsien-Cheng Yen, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/022 (2006.01); H01S 5/0687 (2006.01); G01C 3/08 (2006.01); H04N 5/232 (2006.01); H01S 5/042 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02216 (2013.01); G01C 3/08 (2013.01); H01S 5/02252 (2013.01); H01S 5/02288 (2013.01); H01S 5/02292 (2013.01); H01S 5/0427 (2013.01); H01S 5/0687 (2013.01); H04N 5/23216 (2013.01); H04N 5/23241 (2013.01); H04N 5/23293 (2013.01); H04N 5/23296 (2013.01);
Abstract

A laser module with a flattened structure is installed on a mobile device for a camera program installed in the mobile device to operate photo-taking and image measurement. The laser module includes a printed circuit board (PCB), a photodiode embedded on the PCB, an automatic power control integrated circuit embedded on the PCB, and a laser diode chip electrically connected to the PCB. The flattened structure has a top surface of the PCB, a detection surface of a photodiode chip, a first surface of the automatic power control integrated circuit, a connecting surface of the laser diode chip sharing a common plane surface for operation.


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