The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Mar. 13, 2018
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Masahiro Ito, Shizuoka, JP;

Yuta Kawamura, Shizuoka, JP;

Sadaharu Okuda, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/55 (2011.01); H01R 11/12 (2006.01); H01R 12/72 (2011.01); B60R 16/02 (2006.01); H01R 13/24 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01); H01R 12/77 (2011.01); H01R 13/627 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01R 12/55 (2013.01); B60R 16/0215 (2013.01); H01R 11/12 (2013.01); H01R 12/72 (2013.01); H01R 13/2421 (2013.01); H05K 1/0228 (2013.01); H05K 1/117 (2013.01); H05K 1/183 (2013.01); H05K 3/4015 (2013.01); H01R 12/774 (2013.01); H01R 13/6273 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 3/202 (2013.01); H05K 2201/092 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10409 (2013.01);
Abstract

A conductor connection structure of a laminated wiring body includes a plurality of plate wiring members which are made of a conductive material and stacked to each other, an insulating layer which is arranged between the vertically-adjacent plate wiring members to insulate the vertically-adjacent plate wiring members, a connection portion which is provided in an upper surface of each of the plate wiring members on a way in an extending direction of the plate wiring members, and a leading-out portion which takes out the connection portion of a lower plate wiring member among the plurality of plate wiring member while avoiding an upper plate wiring member among the plurality of plate wiring member, the lower plate wiring member is arranged at a layer lower than the upper plate wiring member in the laminated wiring body.


Find Patent Forward Citations

Ito, Masahiro. (2019). Conductor connection structure of laminated wiring body (U.S. Patent No. 10511111). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10511111

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…