The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Dec. 01, 2015
Applicant:
Nuvotronics, Inc., Radford, VA (US);
Inventors:
David Anthony Miller, Apex, NC (US);
Hooman Kazemi, Thousand Oaks, CA (US);
Ankush Mohan, Thousand Oaks, CA (US);
Yoonyoung Jin, The Woodlands, TX (US);
Assignee:
CUBIC CORPORATION, San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/12 (2006.01); H01P 5/12 (2006.01); H01P 11/00 (2006.01); H01P 3/00 (2006.01); H01P 3/08 (2006.01); H01P 5/107 (2006.01); H01P 5/19 (2006.01);
U.S. Cl.
CPC ...
H01P 3/12 (2013.01); H01P 3/003 (2013.01); H01P 3/088 (2013.01); H01P 3/121 (2013.01); H01P 5/12 (2013.01); H01P 11/002 (2013.01); H01P 11/003 (2013.01); H01P 5/107 (2013.01); H01P 5/19 (2013.01);
Abstract
Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.