The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Aug. 20, 2018
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Hwan Hee Jeong, Seoul, KR;

Sang Youl Lee, Seoul, KR;

June O. Song, Seoul, KR;

Ji Hyung Moon, Seoul, KR;

Kwang Ki Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01); H01L 33/44 (2010.01); H01L 33/36 (2010.01); H01L 33/42 (2010.01); H01L 33/06 (2010.01); H01L 33/38 (2010.01); H01L 33/32 (2010.01); H01L 33/10 (2010.01); H01L 33/22 (2010.01); F21Y 105/10 (2016.01); F21K 9/23 (2016.01); F21Y 115/10 (2016.01); F21Y 113/13 (2016.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/36 (2013.01); H01L 33/38 (2013.01); H01L 33/387 (2013.01); H01L 33/40 (2013.01); H01L 33/42 (2013.01); F21K 9/23 (2016.08); F21Y 2105/10 (2016.08); F21Y 2113/13 (2016.08); F21Y 2115/10 (2016.08); H01L 33/0079 (2013.01); H01L 33/10 (2013.01); H01L 33/22 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12032 (2013.01);
Abstract

Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.


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