The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

May. 12, 2014
Applicant:

Fujikura Ltd., Koto-ku, Tokyo, JP;

Inventors:

Wei-Zhi Hu, Sakura, JP;

Kenichi Nakatate, Sakura, JP;

Takeshi Segi, Sakura, JP;

Kenichi Ishibashi, Sakura, JP;

Fumihiko Nishimura, Sakura, JP;

Satoshi Hida, Sakura, JP;

Hitoe Iikura, Sakura, JP;

Hideo Shiratani, Sakura, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); A61B 1/05 (2006.01); A61B 1/00 (2006.01); H04N 5/225 (2006.01); A61B 1/04 (2006.01); H01L 31/0203 (2014.01); G02B 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 31/18 (2013.01); A61B 1/0011 (2013.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); G02B 23/2423 (2013.01); G02B 23/2484 (2013.01); H01L 31/0203 (2013.01); H04N 5/2253 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/8592 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.


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