The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jan. 16, 2018
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jorge A. Kittl, Lakeway, TX (US);

Ganesh Hegde, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7845 (2013.01); H01L 21/76805 (2013.01); H01L 21/76843 (2013.01); H01L 21/76889 (2013.01); H01L 21/76895 (2013.01);
Abstract

A method provides a source-drain stressor for a semiconductor device including source and drain regions. Recesses are formed in the source and drain regions. An insulating layer covers the source and drain regions. The recesses extend through the insulating layer above the source and drain regions. An intimate mixture layer of materials A and B is provided. Portions of the intimate mixture layer are in the recesses. The portions of the intimate mixture layer have a height and a width. The height divided by the width is greater than three. A top surface of the portions of the intimate mixture layer in the recesses is free. The intimate mixture layer is reacted to form a reacted intimate mixture layer including a compound AB. The compound ABoccupies less volume than a corresponding portion of the intimate mixture layer.


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