The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Dec. 12, 2018
Applicant:

Nanohenry, Inc., San Diego, CA (US);

Inventor:

Osman Ersed Akcasu, San Diego, CA (US);

Assignee:

Nano Henry, Inc., San Diego, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 27/01 (2006.01); H03H 3/00 (2006.01); H01L 21/02 (2006.01); H03H 7/01 (2006.01); H01L 21/306 (2006.01); H01L 21/283 (2006.01); H01L 29/94 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 28/92 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/283 (2013.01); H01L 21/30604 (2013.01); H01L 27/016 (2013.01); H01L 28/10 (2013.01); H01L 28/88 (2013.01); H01L 29/94 (2013.01); H03H 3/00 (2013.01); H03H 7/0115 (2013.01); H03H 1/00 (2013.01); H03H 2001/0064 (2013.01); H03H 2001/0078 (2013.01); H03H 2001/0085 (2013.01);
Abstract

High aspect ratio passive electrical components are presented formed from a single-piece silicon (Si) substrate having a textured surface with at least one high aspect ratio structure. The high aspect ratio structure includes a Si core having a width (C), a height (C), and a minimum aspect ratio of C-to-Cof at least 5:1. An electrical conductor layer overlies the Si core. The electrical component may be a capacitor, inductor, or transmission line. In the case of a capacitor, the substrate textured first surface is made up of a plurality of adjacent high aspect ratio conductor-dielectric-Si (CDS) structures. Each CDS structure includes: a Si core, a dielectric layer overlying the Si core, and an electrical conductor layer overlying the dielectric layer. The Si cores may be formed in the geometry of parallel ridges, columns, or as a honeycomb. Each Si core comprises at least 90% of the CDS structure height.


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