The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Feb. 21, 2017
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventors:

Kazuatsu Ito, Sakai, JP;

Seiji Kaneko, Sakai, JP;

Yohsuke Kanzaki, Sakai, JP;

Takao Saitoh, Sakai, JP;

Makoto Nakazawa, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/51 (2006.01); H01L 29/786 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/1368 (2013.01); H01L 27/1225 (2013.01); H01L 27/1274 (2013.01); H01L 27/1288 (2013.01); H01L 29/41733 (2013.01); H01L 29/42384 (2013.01); H01L 29/51 (2013.01); H01L 29/78651 (2013.01); H01L 29/78684 (2013.01);
Abstract

A method of producing a semiconductor device according to an embodiment of the present invention includes: step (C) of forming an oxide semiconductor layer of a plurality of thin film transistors on a gate dielectric layer; step (F) of forming an aperture in an interlevel dielectric layer, the aperture being located between an active region and a plurality of terminal portions and extending through the interlevel dielectric layer; and step (G) of, after step (F), forming an upper conductive portion on the interlevel dielectric layer. In step (C), a protection layer made of the same oxide semiconductor film as the oxide semiconductor layer is formed above a region of the gate dielectric layer that is located between the active region and the plurality of terminal portions. In step (F), the aperture is formed so as to overlap the protection layer.


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