The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Apr. 09, 2018
Toshiba Memory Corporation, Minato-ku, JP;
Masayoshi Tagami, Kuwana, JP;
Ryota Katsumata, Yokkaichi, JP;
Toru Matsuda, Yokkaichi, JP;
Yu Hirotsu, Kuwana, JP;
Naoki Yamamoto, Kuwana, JP;
Toshiba Memory Corporation, Minato-ku, JP;
Abstract
According to one embodiment, a semiconductor device includes a stacked body, first, second, third, and fourth insulating bodies, first and second columnar portions. The stacked body includes a conductive layer and an insulating layer stacked alternately. The first, second, third and fourth insulating bodies, the first and second columnar portions are provided inside the stacked body. The second insulating body is at a position different from the first insulating body. The third insulating body is between the first and second insulating bodies. The fourth insulating body is between the first and second insulating bodies, and includes portions contacting the third insulating body and being separated from each other with the third insulating body interposed. The first columnar portion is between the first and fourth insulating bodies. The second columnar portion is between the second and fourth insulating bodies. The first and second columnar portions include a semiconductor layer.