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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10510702 B1

PDFFull Text
Date of Patent:
Dec. 17, 2019

Filed:

Aug. 13, 2018

Stacked radio frequency devices

Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Ambarish Roy, Waltham, MA (US);

Yu Zhu, Wellesley, MA (US);

Christophe Masse, Andover, MA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:

Chang & Hale LLP

Primary Examiner:

Victoria K Hall

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 29/66 (2006.01); H01Q 1/00 (2006.01); H01L 23/552 (2006.01); H03K 17/687 (2006.01); H01L 25/07 (2006.01); H01L 23/66 (2006.01); H03K 17/10 (2006.01); H01L 29/417 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/074 (2013.01); H01L 29/66 (2013.01); H01Q 1/00 (2013.01); H03K 17/102 (2013.01); H03K 17/6871 (2013.01); H01L 23/50 (2013.01); H01L 29/41758 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1302 (2013.01); H01L 2224/141 (2013.01); H01L 2224/161 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1701 (2013.01); H01L 2224/171 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/381 (2013.01);
Abstract

Various implementations enable management of parasitic capacitance and voltage handling of stacked integrated electronic devices. Some implementations include a radio frequency switch arrangement having a ground plane, a stack and a first solder bump. The stack is arranged in relation to the ground plane, and includes switching elements coupled in series with one another, and a first end of the stack includes a respective terminal of a first one of the plurality of switching elements. The first solder bump is coupled to the respective terminal of the first one of the plurality of switching elements such that at least a portion of the first solder bump overlaps with one or more of the plurality of switching elements, an overlap dimension set in relation to a first threshold value in order to set a respective contribution to a parasitic capacitance of the radio frequency switch arrangement.

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