The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Sep. 28, 2017
Tsinghua University, Haidian District, Beijing, CN;
Nuctech Company Limited, Haidian District, Beijing, CN;
Wenjian Zhang, Beijing, CN;
Qingjun Zhang, Beijing, CN;
Yuanjing Li, Beijing, CN;
Zhiqiang Chen, Beijing, CN;
Ziran Zhao, Beijing, CN;
Yinong Liu, Beijing, CN;
Yaohong Liu, Beijing, CN;
Xiang Zou, Beijing, CN;
Huishao He, Beijing, CN;
Shuwei Li, Beijing, CN;
Nan Bai, Beijing, CN;
Tsinghua University, Haidian District, Beijing, CN;
NUCTECH COMPANY LIMITED, Haidian District, Beijing, CN;
Abstract
The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.