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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10510636 B1

PDFFull Text
Date of Patent:
Dec. 17, 2019

Filed:

Jul. 14, 2017

Electronic module

Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Kosuke Ikeda, Hanno, JP;

Osamu Matsuzaki, Hanno, JP;

Assignee:

SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;

Attorney:

Ladas & Parry, LLP

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H01L 23/12 (2006.01); H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 21/4814 (2013.01); H01L 23/12 (2013.01); H01L 23/3735 (2013.01); H01L 23/49555 (2013.01); H01L 23/66 (2013.01); H01L 24/33 (2013.01); H01L 24/37 (2013.01); H01L 25/07 (2013.01); H05K 5/06 (2013.01); H01L 23/49531 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/4024 (2013.01); H01L 2224/4026 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/83447 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19106 (2013.01);
Abstract

An electronic module comprises a substrate, an other-side electronic componentprovided on the other side of the substrate, a one-side electronic componentprovided on one side of the substrateand a connecting terminalhaving an other-side extending partextending to circumferential outside of the substrateon the other side of the substrate, a one-side extending partextending to circumferential outside of the substrateon one side of the substrate, and a connecting partconnecting the other-side extending partwith the one-side extending partat the circumferential outside of the substrate

Find Patent Forward Citations

Ikeda, Kosuke. (2019). Electronic module (U.S. Patent No. 10510636). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10510636

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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