The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Dec. 21, 2016
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/0085 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01);
Abstract
A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce a multi-layer chip having a side surface from which the internal electrodes are exposed; removing a superficial layer of the side surface of the multi-layer chip; and providing a side margin to the side surface of the multi-layer chip, the superficial layer being removed from the side surface.